Productronica 2017: Industry 4.0 for your business

Visit us at Productronica at booth B2, stand 118 Being projected into the future is in our company’s DNA, both to anticipate trends and to embark on new models for business growth and competitiveness. This requires two indispensable prerogatives: customer focus and investment in new technologies, especially digital technologies, as …

Base PCB Material: What to choose? – Vol.2

BASE MATERIAL: WHAT TO CHOOSE? Time To Delamination (T260, T288 and T300): Delamination or separation of the layers in printed circuit boards during the manufacturing process (particularly wave soldering) is a leading cause of product failure. Hence, there is the need for a quick test which can predict failure before …

PreventLAB Seminary

PreventLAB in collaboration with IEMME S.p.a is pleased to announce, at the Peraga di Vigonza (PD) laboratory, the appointment with the newest technical seminary on June 29. Topics discussed: Laminates and material choice Chemical products used in PCB assembly Industry 4.0 logistic products Conformal coating types, deposition and failure analysis Reliability …

Base PCB Material: What to choose?

Because of the diversity of materials available and the wide range of applications, the concept of an “ideal laminate” has become not so clear. A material ideal for a high temperature application may be impractical in a microwave or high speed digital design, for instance. As a result, while we …

NURENBERG EXHIBITION

SMT Hybrid Packaging 2017 “International Exhibition and Conference for System Integration in Micro Electronics” SMT Hybrid Packaging will take place in Nuremberg from the 16th to the 18th of May 2017. It is the only event in Europe which takes a comprehensive view of system integration in microelectronics from the …

Sulphur Damages in Electronic Assemblies

Introduction Electronic assemblies are often requested to function in critical service environments. They are submitted to extreme moisture and temperature conditions and sometimes they are also prone to chemical exposure of corrosive agents which could be responsible of severe failures. These conditions are due to atmosphere, to fluxes residues employed …

Sulphur Damages in Electronic Assemblies

Introduction Electronic assemblies are often requested to function in critical service environments. They are submitted to extreme moisture and temperature conditions and sometimes they are also prone to chemical exposure of corrosive agents which could be responsible of severe failures. These conditions are due to atmosphere, to fluxes residues employed …

Conductive Anodic Filament failure analysis (CAF)

Abstract Conductive anodic filament have been increasing concerning about PCB reliability in the last few years. To meet miniaturizing needs and satisfy higher performances, a more and more mayor PCB density is forcing PCB design toward closer conductors, smaller pitches, single-ply dielectrics. Often electrical applications are requested to function in …

Quadra™ 7 Nordson DAGE – X-Ray Inspection

Abstract The technological innovation arrives in the new business unit of Preventlab recetnly opened in Padova. Nordson DAGE, leader in X-Ray inspection for electronic assemblies, released a brand new equipment characterized by a high resolution and a great reliability: Nordson Dage Quadra™ 7. The Quadra™ 7 is designed to deliver …