Base PCB Material: What to choose?

Because of the diversity of materials available and the wide range of applications, the concept of an “ideal laminate” has become not so clear. A material ideal for a high temperature application may be impractical in a microwave or high speed digital design, for instance. As a result, while we …

Sulphur Damages in Electronic Assemblies

Introduction Electronic assemblies are often requested to function in critical service environments. They are submitted to extreme moisture and temperature conditions and sometimes they are also prone to chemical exposure of corrosive agents which could be responsible of severe failures. These conditions are due to atmosphere, to fluxes residues employed …

Sulphur Damages in Electronic Assemblies

Introduction Electronic assemblies are often requested to function in critical service environments. They are submitted to extreme moisture and temperature conditions and sometimes they are also prone to chemical exposure of corrosive agents which could be responsible of severe failures. These conditions are due to atmosphere, to fluxes residues employed …

Conductive Anodic Filament failure analysis (CAF)

Abstract Conductive anodic filament have been increasing concerning about PCB reliability in the last few years. To meet miniaturizing needs and satisfy higher performances, a more and more mayor PCB density is forcing PCB design toward closer conductors, smaller pitches, single-ply dielectrics. Often electrical applications are requested to function in …