BASE MATERIAL: WHAT TO CHOOSE? Time To Delamination (T260, T288 and T300): Delamination or separation of the layers in printed circuit boards during the manufacturing process (particularly wave soldering) is a leading cause of product failure. Hence, there is the need for a quick test which can predict failure before …
PreventLAB in collaboration with IEMME S.p.a is pleased to announce, at the Peraga di Vigonza (PD) laboratory, the appointment with the newest technical seminary on June 29. Topics discussed: Laminates and material choice Chemical products used in PCB assembly Industry 4.0 logistic products Conformal coating types, deposition and failure analysis Reliability …
Because of the diversity of materials available and the wide range of applications, the concept of an “ideal laminate” has become not so clear. A material ideal for a high temperature application may be impractical in a microwave or high speed digital design, for instance. As a result, while we …
