Preventlab organizes workshops tailored on different arguments such as laminates, finishes, PCB manufacturing, assembly processes, solder pastes and fluxes, IPC courses and failure analyses.
By attending these events, participants have the opportunity to share their experiences and improve their knowledge.
IPC A 610, IPC A 600, IPC 6012, IPC 7721, IPC 7711, IPC A 620 teached by Istituto Italiano Saldatura (IIS)
- PCB manufacturing: double sided up to multilayer HDI
- PCB manufacturing: double sided up to multilayer HDI
- PCB manufacturing: chemical and galvanic processes
- PCB base materials: main characteristics
- PCB laminates: the proper choice
- PCB Conductive Anodic Filament (CAF) failure
- PCB Copper foil and plating: IPC A600 -6012 requirements and lab analyses
- PCB finishes: advantages and disadvantage
- PCB ENIG finished: black pad phenomenon
- PCB HAL finished: wettablility issues
- PCB vias coverage
- PCB panel arrays
- PCB manufacturing defects: lab analyses
- PCB storage and handling
- PCB solder mask adhesion
- PCB ENIG adhesion
- PCB wetting test methods
- PCB bow and twist
- Introduction to PCB soldering methods
- PTH soldering process
- SMT soldering process
- Solder alloys and fluxes: the proper choice
- Voids phenomenon in solder joints
- Conformal coating: typologies and characteristics
- Cleanliness: Total Ionic Contamination and Ion Chromatography
- Strain Gage test
- PCBA reliability
- PCBA MTBF
- HR-T and chemical contaminants failures
- Case history: ENIG finish vs SAC305/307 solder pastes
- Case history: HAL finish vs SAC305/307 solder pastes
- Case history: HAL finish vs SAC305/0807 solder pastes
- Case history: SAC305 solder paste vs ENIG -Imm Ag – OSP finish
- Case history: solder joints grain structure effects
