SMT Hybrid Packaging 2017
“International Exhibition and Conference for System Integration in Micro Electronics”
SMT Hybrid Packaging will take place in Nuremberg from the 16th to the 18th of May 2017. It is the only event in Europe which takes a comprehensive view of system integration in microelectronics from the initial idea and its development right through to the production of all technical processes during the manufacture of electronic assemblies.
This exhibition offers conferences and tutorials regarding the latest trends and solution opportunities from various fields of electronic assembly.
Nowadays technology provides new opportunities, offers quality of life and process efficiency and its role as the driver of human culture grows constantly.
Already today and even more so in the future it will support mankind in a sustainable use of resources. For these reasons we will participate at this event as PreventPCB and we invite you to come numerous to our stand (Halle A5-Stand 5-308)!
